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Compression type connector developed for compact equipment such as mobile phone. Projected area is only 2.0 x 2.8mm (.079" x .110"), with 1.8mm (.071") height. Despite its smallness, the contact provides contact pressure of 0.7N per circuit thanks to the curled spring design, giving stable contact performance even under conditions of vibration. Compact Projected area is only 2.0 x 2.8mm (.079" x .110"), with 1.8mm (.071") height. High contact pressure Despite its smallness, the contact provides contact pressure of 0.7N per circuit thanks to the curled spring design, giving stable contact performance even under conditions of vibration. Heat resistant design suitable for surface mounting The housing is made of highly heat-resistant plastic to allow reflow soldering. Emboss taping for automatic mounting The MIH connector is supplied in the form of emboss taping for automatic mounting. RoHS Compliant